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Mitsubishi Electric Begins Supplying Power Semiconductor Chips Made from 12-inch Wafers for Semiconductor Module AssemblyStable supply of Si power semiconductor chips expected to support green transformation

FOR IMMEDIATE RELEASE No. 3733

  • Dicing 12-inch Si wafer to make chips

  • Line for processing 12-inch Si wafers (8-inch wafer on right)

TOKYO, September 30, 2024 - Mitsubishi Electric Corporation (TOKYO: 6503) announced today that its Power Device Works' Fukuyama Factory has begun large-scale supply of power semiconductor chips made from 12-inch silicon (Si) wafers for the assembly of semiconductor modules, effective immediately. The advanced Si power-semiconductor modules will initially be used in consumer products. Going forward, Mitsubishi Electric expects to contribute to green transformation (GX) by providing a stable and timely supply of semiconductor chips to meet the growing demand for energy-saving power-electronics devices in various applications.

The Fukuyama Factory processes wafers for the production of Si power-semiconductors. The factory is playing a key role in Mitsubishi Electric's medium-term plan to double its wafer processing capacity for Si power- semiconductors by fiscal 2026 compared to five years earlier. By supplying large quantities of 12-inch Si wafers for power semiconductor chips, the company will ensure stable production of advanced Si power-semiconductor modules for energy-saving power-electronics equipment.

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